KUALA LUMPUR (May 29): Eversendai Corporation Bhd's subsidiary Shineversendai Engineering (M) Sdn Bhd has been appointed as a sub-subcontractor for the structural steel fabrication and erection works for the Tokuyama Malaysia Polycrystalline-Silicon Project (TMP2) in Bintulu worth RM37.1 million.
Eversendai said on Tuesday that its unit had secured the sub-contract from the sub-contractor Taisei Corporation, and that the scope of work includes the procurement of the raw materials, production of the related shop/fabrication drawings, fabrication, shipping/transportation to the site, off-loading and erection.
It said the works were expected to be completed at the end of 2012. Eversendai said the Tokuyama Contract was expected to contribute positively to its earnings for FY2012.